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this is information on a product in full production. june 2012 doc id 13462 rev 3 1/11 11 ESDARF01-1BM2 esd protection for am and fm antenna datasheet ? production data features single line bidirectional protection very low capacitance (3 pf typical) lead-free package very low capacitance, line to ground, for optimized data integrity low pcb space consumption: 0.6 mm 2 max no insertion loss in am and fm band high reliability offered by monolithic integration complies with the following standards iec 61000-4-2: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g- method 3015-7: class 3b: applications where transient over voltage protection in esd sensitive equipment is required, such as: portable audio systems communication systems cellular phone handsets and accessories audio and video equipment description the ESDARF01-1BM2 is a monolithic application specific device dedicated to esd protection of the am and fm antenna in cell phones and portable equipment. the device is ideal for applications where both reduced printed circuit board space and power absorption capability are required. figure 1. functional diagram 2 1 sod-882 1 2 www.st.com
characteristics ESDARF01-1BM2 2/11 doc id 13462 rev 3 1 characteristics 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings symbol parameter value unit v pp (1) peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 15 kv t j maximum operating junction temperature 125 c t stg storage temperature range - 55 to +150 c t l maximum lead temperature for soldering during 10 s at 5 mm for case 260 c v i v cl v cl v br v br v rm v rm i rm i pp slope: 1/r d symbol parameter v = breakdown voltage v = stand-off voltage v = clamping voltage i = peak pulse current br rm cl pp i = leakage current @ v rm rm table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions value unit min. typ. max. v br breakdown voltage i r = 1 ma 0.7 1.0 1.3 v i rm leakage current v rm = 100 mv 0.3 a c i/o-i/o capacitance between i/o and gnd v r = 0 v, f = 1 mhz, any i/o pin to gnd 33.5pf
ESDARF01-1BM2 characteristics doc id 13462 rev 3 3/11 figure 7. junction capacitance versus frequency (typical values) figure 3. relative variation of leakage current versus junction temperature (typical values) figure 4. s21 attenuation measurements (50 / 50 ) 1 10 25 50 75 100 125 i r [t j ]/i r [t j =25c] v r =100 mv t j (c) db 100k 1m 10m 100m 1g 6g -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 f (hz) figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) 50 ns/div 20 v/div 50 ns/div 20 v/div 8.00 6.00 4.00 2.00 0.00 c (pf) f (mhz) 1 10 100 1000
application schematics ESDARF01-1BM2 4/11 doc id 13462 rev 3 2 application schematics figure 8. application schematics 270 nh 100 nf to fm rf input of the fm module to reference of earpieces (audio amplifier) to bottom connector, reference of the earpieces and fm antenna esdarf01 - 1bm2 fm receiver when the reference of earpieces (audio amplifier) is different from 0 v 270 nh to fm rf input of the fm module to bottom connector, reference of the earpieces and fm antenna esdarf01 - 1bm2 fm receiver when the reference of earpieces (audio amplifier) is 0 v to fm rf input of the fm module ESDARF01-1BM2 fm receiver 270 nh 100 nf to reference of earpieces (audio amplifier) to bottom connector, reference of the earpieces and fm antenna whatever the reference of earpieces (audio amplifier)
ESDARF01-1BM2 ordering information scheme doc id 13462 rev 3 5/11 3 ordering information scheme figure 9. ordering information scheme esda rf 01 - 1b m2 esd protection device application package m2 = sod-882 rf antenna b = bidirectional number of lines directional
package information ESDARF01-1BM2 6/11 doc id 13462 rev 3 4 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. sod882 dimension definitions table 3. sod882 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.40 0.47 0.50 0.016 0.019 0.020 a1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 d 0.55 0.60 0.65 0.022 0.024 0.026 e 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 l1 0.20 0.25 0.30 0.008 0.010 0.012 l2 0.20 0.25 0.30 0.008 0.010 0.012 pin # 1 id e d a1 a l1 e l2 b2 b1
ESDARF01-1BM2 package information doc id 13462 rev 3 7/11 note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 13. tape and reel specifications figure 11. sod882 footprint in mm (inches) figure 12. marking 0.55 (0.022) 0.40 (0.016) 0.50 0.020 0.55 (0.022) pin1 pin 2 i n cathode bar user direction of unreeling all dimensions in mm 4.0 2.0 8.0 2.0 1.75 3.5 ? 1.55 0.6 0.68 0.20 1.10 d d d d d d d
recommendation on pcb assembly ESDARF01-1BM2 8/11 doc id 13462 rev 3 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 60% to 75%. 5.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 =
ESDARF01-1BM2 recommendation on pcb assembly doc id 13462 rev 3 9/11 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.5 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
ordering information ESDARF01-1BM2 10/11 doc id 13462 rev 3 6 ordering information 7 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDARF01-1BM2 d (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location sod882 0.9 mg 12000 tape and reel table 5. document revision history date revision changes 17-apr-2007 1 first issue 17-nov-2010 2 updated figure 4 . and updated opening to footprint ratio to 60% - 75% in section 5: recommendation on pcb assembly . updated base qty in table 4. 13-jun-2012 3 updated ta b l e 3 and added figure 10 .
ESDARF01-1BM2 doc id 13462 rev 3 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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